Aluminium Nitride
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GENERAL OVERVIEW
Aluminium Nitride has the highest thermal conductivity of any ceramic material (on par with most metals), as well as extremely good electrical insulation. This makes it the top-of-the-range choice for the most demanding of heat sink applications. It is often used in microelectronics, lighting, power, optics and the ever-growing field of renewable energy.
It is stable up to 1000 °C / 1800 °F in air and 1900 °C / 3450 °F in inert atmospheres. Aluminium Nitride is often used instead of aluminium as a heat sink material for semiconductors. This is due to its relatively lower thermal expansion coefficient which better matches that of the semiconductor, reducing the thermal stresses generated during operation.
Aluminium Nitride has a high mechanical strength, allowing it to be produced as very thin tiles (down to 0.4mm thick). Our fully Sintered Aluminium Nitride which has an exceptional thermal conductivity of 170 W/mK.
TECHNICAL INFORMATION
| Aluminium Nitride | |
| General Information | |
| Max. Usage Temperature | 1000 °C / 1800 °F |
| Bulk Density | 3.3 g/cm³ |
| Open Porosity | < 0.5 % |
| Modulus of Rupture @ Room Temp. | 300 MPa |
| Modulus of Elasticity | 350 GPa |
| Thermal Conductivity | > 170 W/mK |
| Thermal Expansion at 20 – 1000 °C | 5.5 x10-6/K |
| Volume Resistance | < 10¹⁵ Ωcm |
| Dielectric Constant | 9 |
All figures are typical figures determined using laboratory test pieces and might not always be an accurate representation of production item.
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